EMBEDDED AC MITIGATION SYSTEM (US PATENT #9774105)
The new approach for AC mitigation employs a conductive plate attachment on top of a high-efficiency/dielectric coating. The protective coating will act as a dielectric, creating a capacitor on the pipeline.
The surface area of the conductive plate is calculated to create a low resistance path for current to be grounded properly based on soil resistivity of the location that the conductive plate is going to installed. The installation locations will be selected based on AC modeling or field surveys which indicate AC voltage rise.
The capacitor created on the pipeline will act as a DC decoupler, which passes the AC current and has no effect on the DC current. The conductive plate is formable to create a perfect couple on pipelines with varying diameters. Additionally, the conductive plate has no direct electrical connection to the pipe surface. This approach will resolve the induced AC current/voltage issues in the pipeline system caused by highly dielectric properties of new generation coatings. This approach will also decrease the potential for AC voltage accumulation in the pipeline system in a cost-efficient and safe manner. The conductive plate can be designed and installed with a semiconductive material directly on the pipe surface to mitigate fault conditions. In special circumstances, the plate can be attached to grounding devices to create a more efficient grounding path.